Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging - Lian-Tuu Yeh - Books - American Society of Mechanical Engineers - 9780791861936 - January 30, 2020
In case cover and title do not match, the title is correct

Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging

Lian-Tuu Yeh

Price
$ 138.49

Ordered from remote warehouse

Expected delivery Dec 3 - 16
Christmas presents can be returned until 31 January

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging

Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.

277 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 30, 2020
ISBN13 9780791861936
Publishers American Society of Mechanical Engineers
Pages 277
Dimensions 237 × 160 × 24 mm   ·   602 g
Show all

More by Lian-Tuu Yeh

See all of Lian-Tuu Yeh ( e.g. Hardcover Book and Paperback Book )