Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging - Lian-Tuu Yeh - Books - American Society of Mechanical Engineers - 9780791861097 - July 30, 2016
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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging 2 Revised edition

Lian-Tuu Yeh

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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging 2 Revised edition

This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

500 pages, black & white illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released July 30, 2016
ISBN13 9780791861097
Publishers American Society of Mechanical Engineers
Pages 500
Dimensions 152 × 229 × 29 mm   ·   866 g
Language English  
Series Editor Agonafer, D.
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