Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices - X Tian - Books - Wiley-VCH Verlag GmbH - 9783527352425 - January 17, 2024
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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

X Tian

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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

550 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 17, 2024
ISBN13 9783527352425
Publishers Wiley-VCH Verlag GmbH
Pages 368
Dimensions 251 × 175 × 24 mm   ·   834 g
Language German  
Editor Tian, Xingyou (Chinese Academy of Sciences)

See all of X Tian ( e.g. Hardcover Book )