Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science - King-Ning Tu - Books - Springer-Verlag New York Inc. - 9781441922847 - November 19, 2010
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Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science Softcover reprint of hardcover 1st ed. 2007 edition

King-Ning Tu

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Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science Softcover reprint of hardcover 1st ed. 2007 edition

The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.

370 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 19, 2010
ISBN13 9781441922847
Publishers Springer-Verlag New York Inc.
Pages 370
Dimensions 155 × 235 × 20 mm   ·   539 g
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