ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020) - American Society of Mechanical Engineers - Books - American Society of Mechanical Engineers - 9780791884041 - July 31, 2024
In case cover and title do not match, the title is correct

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

American Society of Mechanical Engineers

Login to be notified when the product is available again
Christmas presents can be returned until 31 January

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

566 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released July 31, 2024
ISBN13 9780791884041
Publishers American Society of Mechanical Engineers
Pages 566
Dimensions 800 g
Show all

More by American Society of Mechanical Engineers

See all of American Society of Mechanical Engineers ( e.g. Paperback Book and Hardcover Book )