Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019) - Asme - Books - American Society of Mechanical Engineers - 9780791859322 - June 30, 2020
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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Asme

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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.

836 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 30, 2020
ISBN13 9780791859322
Publishers American Society of Mechanical Engineers
Pages 836
Dimensions 279 × 215 × 48 mm   ·   1.88 kg
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