Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Jennie Hwang - Books - Van Nostrand Reinhold Inc.,U.S. - 9780442013530 - September 24, 1992
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

Jennie Hwang

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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

456 pages, 77 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 24, 1992
ISBN13 9780442013530
Publishers Van Nostrand Reinhold Inc.,U.S.
Pages 456
Dimensions 152 × 229 × 24 mm   ·   639 g
Language English  
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