Area Array Package Design - Ken Gilleo - Books - McGraw-Hill - 9780071737739 - October 24, 2003
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Area Array Package Design

Ken Gilleo

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Area Array Package Design

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 24, 2003
ISBN13 9780071737739
Publishers McGraw-Hill
Pages 220
Dimensions 231 × 11 × 188 mm   ·   385 g
Language English  
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